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| Shimorez E-38A / Hardener E-38B / Accelerator A-01 |
| Shimorez E-38/A is a viscous, unmodified resin. Hardener E-38/B is a liquid anhydride. It is used as a heat curing system. Due to the low viscosity of the system, it is used as impregnating material for electronic capacitors. |
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| Shimokote E-39/A / Hardener E-39/B / Diluent E-39C |
| Shimokote E-39/A is a thixotropic epoxy resin. Hardener E-39/B is an aromatic polyamine and Diluent E-39C is an aromatic thinner. The system is heat curing. It gives a thick coating on electronic components. The method of application is by dip coating. |
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| Shimorez-403 GC / Hardener 61 |
| Shimorez-403 GC is a thixotropic epoxy resin. With Hardener 61 it gives thick coatings on windings of motors and transformers. This system is a room temperature curing system. It has a short curing time. |
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| Shimorez-403 GC / Hardener 43 |
| Shimorez-403 GC is a thixotropic epoxy resin. With Hardener 43 it gives resilient thick flexible coatings on windings of motors and transformers. The system has a long pot life. |
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Electronic Circuits & Assemblies
(including auto-electronics, capacitors etc) |
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| Shimokote 9 / Hardener 43 |
| Shimokote 9 is a filled epoxy resin. Hardener 43 is a low viscosity polyamide amine. The system has a long pot life and the cured product is hard and tough. The system contains non-abrasive fillers. Hence, it is suitable for application with Dosing machines. Curing is carried out at room temperature. Hardness : Shore D-75 HDT 50. |
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| Shimokote 10 / Hardener 43 |
| Shimokote 10 is a flexible epoxy resin. It contains non-abrasive fillers. Hardener 43 is a low viscous polyamide amine. Cured product of the system is flexible. The system has a long pot life at room temperature. The system is recommended for potting of pressure sensitive electronic assemblies. Hardness : Shore A-80 HDT is lower than room temperature. |
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| Shimokote 11 / Hardener 43 |
| Shimokote 11 is highly flexible. It contains non-abrasive fillers. Hardener 43 is a low viscous polyamide amine. The cured product is highly flexible. It is recommended for encapsulation of pressure sensitive electronic components. The system can be applied with dosing machine. Hardness : Shore A-50 HDT is lower than room temperature. |
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| Shipal 30 / Hardener IS-16 |
| Very flexible, two component, room temperature curing PUR system. Shore A-50 Hardness. It does not contain any fillers. Recommended for potting of pressure sensitive electronic assemblies. |
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| Shipal 40 / Hardener IS-32 |
| Two component PUR casting system, containing fillers. It cures at ambient temperatures with low exotherm. Cured mass is tough-flexible, Shore D-70 Hardness. Glass transition temperatures is approx. 55 oC. Cured product has excellent thermal shock resistance and improved impact resistant strength. |
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| Shimocast 101 / Hardener IS-32 |
| Two component, room temperature curing PUR system containing fillers. Cured mass is flexible. Shore A-75 Hardness. Good adhesion to metallic substrates. Low shrinkage. |
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| Shipal 30B / Hardener IS-16 |
| The system contains inorganic fillers, cured mass is highly flexible. Shore A-55 Hardness. Mixture of two components is cured at room temperature. Exotherm is very low. Recommended for sealing of electronic assemblies. |
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